By Mark Sutton
Global Foundries begins construction work on new chip-manufacturing facility
Semi-conductor company Global Foundries has announced that it has broken ground for its new $4.2 billion fab.
The Fab 2 manufacturing facility, in New York state, will produce 300mm wafers based 28nm technology, with plans to transition to 22nm.
Global Foundries, which is part-owned by Abu Dhabi’s Advanced Technology Investment Company (ATIC), already has a fab in Dresden, Germany, but plans for the new facility to become the most technologically advanced fab in the world.
Hector Ruiz, chairman of Global Foundries said: “Semiconductors are the building blocks of technology innovation and are present in everything from mobile phones to kitchen appliances and solar panels. As today’s chip designers push the boundaries on the next generation of products, there is a growing need for a new approach to design and manufacturing rooted in collaboration and innovation.
“With Fab 2, Global Foundries moves the semiconductor industry away from the traditional model of isolated regional development and into an era of global hubs of manufacturing and technology expertise,” he added.
Construction of the plant is expected to take three years, with volume production of semiconductors at the plant in 2012.